Preparation of ceria abrasives with surfactants-oriented morphology and valance state control and their application in magnetic-field assisted chemical mechanical polishing for K9 glass

Magnetic-field assisted chemical mechanical polishing (MFA-CMP) has emerged as a promising approach for ultra-precision optical manufacturing. But it still faces critical challenges in simultaneously achieving high material removal rate (MRR), excellent surface quality, and stable abrasive dispersion under strong magnetic and shear fields. In particular, the optimization of ceria-based abrasives and magnetorheological slurry compositions remains a key bottleneck limiting process controllability and surface integrity. This manuscript explores the role of surfactant-assisted hydrothermally synthesized cerium oxide (CeO 2 ) abrasives—synthesized using anionic (SDS), cationic (CTAB), and nonionic (PVP) modifiers—in regulating dispersion behavior and polishing performance. Dispersion tests under mechanical agitation, ultrasonication, and pH variation reveal that PVP-assisted CeO 2 exhibits superior colloidal stability. Tribological tests show that PVP-based slurries achieve a favorable balance between friction coefficient and MRR, with a maximum MRR of ∼ 47 mm 3 ·min −1 at 4 wt% CeO 2 . Applied to K9 glass polishing, this slurry yields a sub-nanometer surface roughness (Ra ∼ 0.4 nm) without observable scratches. The enhanced performance is attributed to PVP-induced steric stabilization and controlled abrasive–substrate interactions. This manuscript provides a mechanistic insight into the dispersion and interfacial behavior of CeO 2 in MFA-CMP, and provides new guidance for high-efficiency and low-damage precision polishing systems.