Double interface bonding mechanism of Cu/Sn/Cu sandwich structure by electromagnetic pulse welding

Materialia 2026

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Authors: Limeng Yin, Zilong Su, Hong Jiang, Yaoning Sun, Long Zhang, Yong Yin, Yuhua Chen, Wei Feng, Danni Song
DOI: 10.1016/j.mtla.2026.102649
Cited by: 1
References: 18

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Advanced Welding Techniques Analysis Intermetallics and Advanced Alloy Properties

Publication details

Journal / source
Materialia
Publisher
Elsevier BV
Volume
45
Pages
102649–102649
Publication date
2 January 2026
Language
EN