Suppression of interfacial IMCs spallation in Ni-P/SAC305 joints via barrier layer morphology control
Fields of Study & Subjects
Electronic Packaging and Soldering Technologies
Electrodeposition and Electroless Coatings
Intermetallics and Advanced Alloy Properties
Publication details
- Journal / source
- Materialia
- Publisher
- Elsevier BV
- Volume
- 45
- Pages
- 102654–102654
- Publication date
- 7 January 2026
- Language
- EN