Self-limited intermetallic growth in Cu/Ti joints induced by an electromigration-enhanced Kirkendall plane

Materialia 2026

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Authors: Mei Rao, Wei Feng, Wenxuan Xu, Ruizhi Zhang, Jian Zhang, Guoqiang Luo
DOI: 10.1016/j.mtla.2026.102743
Cited by: 1
References: 29

Fields of Study & Subjects

Copper Interconnects and Reliability Semiconductor materials and interfaces Intermetallics and Advanced Alloy Properties

Publication details

Journal / source
Materialia
Publisher
Elsevier BV
Volume
46
Pages
102743–102743
Publication date
8 April 2026
Language
EN