Atomic-level engineering anisotropic thermal transport for directional heat dissipation in silicon electronics

Materials Today Physics 2026

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Authors: Qikun Tian, Ailing Chen, Haofeng Qin, Haofeng Qin, Ruyi Li, Yi Zhang, Yuting Jiang, Xiong Zheng, Zhenzhen Qin, Zhenzhen Qin, Guangzhao Qin
DOI: 10.1016/j.mtphys.2026.102049
Cited by: 1
References: 59

Fields of Study & Subjects

Thermal properties of materials Silicon and Solar Cell Technologies Machine Learning in Materials Science

Publication details

Journal / source
Materials Today Physics
Publisher
Elsevier BV
Volume
62
Pages
102049–102049
Publication date
11 February 2026
Language
EN