Elution rate of Cu film synthesized by chelate-applied strong heat method on mortar surface into ion-exchange water

Copper (Cu) is a repellent component for organisms attached to the bottoms of ships. A Cu elution rate of 10 μg/cm 2 /day or higher is required to prevent barnacles from attaching to the bottom of ships. However, there is a need to control the excessive Cu elution rate to reduce its environmental impact. In this study, we developed a novel chelate-applied strong heat method that enables the on-site synthesis of Cu antifouling films directly on existing mortar surfaces. The results demonstrated that the elution rate can be controlled by selecting either the gas burner (direct) or ironing (indirect) heating method. Specifically, the gas burner method (2 min) and ironing method (450°C, 4 min) maintained elution rates above the 10 μg/cm²/day threshold for approximately 12 days and 5 days, respectively.