Study on picosecond laser multi-layer modification and stealth dicing of 4H-SiC wafers based on laser power modulation

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Authors: Yixiong Yan, Sijia Chen, Yuxuan Cheng, Cong Mao, Mingjun Zhang, Yujie Zheng, Weidong Tang, Ji’an Duan
Cited by: 2
References: 24

Fields of Study & Subjects

Laser Material Processing Techniques Advanced Surface Polishing Techniques Silicon and Solar Cell Technologies

Publication details

Journal / source
Optics & Laser Technology
Publisher
Elsevier BV
Volume
198
Pages
114882–114882
Publication date
4 February 2026
Language
EN