Study on picosecond laser multi-layer modification and stealth dicing of 4H-SiC wafers based on laser power modulation
Fields of Study & Subjects
Laser Material Processing Techniques
Advanced Surface Polishing Techniques
Silicon and Solar Cell Technologies
Publication details
- Journal / source
- Optics & Laser Technology
- Publisher
- Elsevier BV
- Volume
- 198
- Pages
- 114882–114882
- Publication date
- 4 February 2026
- Language
- EN