Region-adaptive DIC with variable speckle parameters for accurate warpage measurement in electronic packaging structures

Optics & Laser Technology 2026

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Authors: Jianguo Xie, Yuhan Gao, Y. Q. Chen, Kezhong Xu, Yu Ziniu, Chuanjia Wang, Yuqi Zhou, Weibin Hui, Fulong Zhu

DOI: 10.1016/j.optlastec.2026.114906

Cited by: 1

References: 51

Fields of Study & Subjects

Optical measurement and interference techniques Surface Roughness and Optical Measurements 3D IC and TSV technologies

References 51