Laser-induced gas-assisted debonding in advanced packaging applications

Optics & Laser Technology 2026

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Authors: Wenkai Zhao, Yalin Zeng, Fangcheng Wang, Qiang Liu, Wenxue Dai, Mingqi Huang, Guoping Zhang, Rong Sun

DOI: 10.1016/j.optlastec.2026.114956

Cited by: 0

References: 14

Fields of Study & Subjects

3D IC and TSV technologies Laser Material Processing Techniques Electronic Packaging and Soldering Technologies

References 14