Regulating random crack propagation in laser slicing of 4H-SiC wafer via classification characterization and energy-crack morphology mapping

Optics & Laser Technology 2026

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Authors: Zelong Qing, Haiying Wei, Xiaoben Chen, Y Zhang

DOI: 10.1016/j.optlastec.2026.115515

Cited by: 1

References: 33

Fields of Study & Subjects

Advanced Surface Polishing Techniques Laser Material Processing Techniques Silicon and Solar Cell Technologies

References 33