Study on influence of amine curing agents on thermal and mechanical properties of epoxy resin/copper interface using molecular dynamics

Physica B Condensed Matter 2026

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Authors: Kaizhi Gu, Kaiye Xiao, Yang Yang Yang, Xiaoli Shi, Z. B. Zhao
DOI: 10.1016/j.physb.2026.418263
Cited by: 0
References: 30

Fields of Study & Subjects

Epoxy Resin Curing Processes Thermal properties of materials Corrosion Behavior and Inhibition

Publication details

Journal / source
Physica B Condensed Matter
Volume
726
Pages
418263–418263
Publication date
9 January 2026
Language
EN