Thermally assisted interface engineering of optical and dielectric properties of amorphous SiC thin films
Fields of Study & Subjects
Silicon Carbide Semiconductor Technologies
Thin-Film Transistor Technologies
Copper Interconnects and Reliability
Publication details
- Journal / source
- Physica B Condensed Matter
- Publisher
- Elsevier BV
- Volume
- 738
- Pages
- 418849–418849
- Publication date
- 21 May 2026
- Language
- EN