Cu-based thermoelectrics: Frontiers, challenges, and prospects

Progress in Materials Science 2026 Open access

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Authors: Nan‐Hai Li, Xiao-Lei Shi, Dong-Chen Qi, Zhi-Gang Chen

DOI: 10.1016/j.pmatsci.2026.101712

Cited by: 11

References: 506

Fields of Study & Subjects

Advanced Thermoelectric Materials and Devices Copper Interconnects and Reliability Copper-based nanomaterials and applications

References 506