Hygrothermal aging effects on polyimide and acrylate-based adhesive materials in high-performance flat-flex cable assemblies
Fields of Study & Subjects
Electronic Packaging and Soldering Technologies
Polymer Science and PVC
High voltage insulation and dielectric phenomena
Publication details
- Journal / source
- Polymer Degradation and Stability
- Publisher
- Elsevier BV
- Volume
- 247
- Pages
- 112005–112005
- Publication date
- 19 February 2026
- Language
- EN