Hygrothermal aging effects on polyimide and acrylate-based adhesive materials in high-performance flat-flex cable assemblies

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Authors: Christina A. Fox, Henry Reinstein, Brandon R. Foley, Nicholas T. Liesen, Matthew P. Kroonblawd, Amitesh Maiti, Roland Faller, Richard Hayes Gee
Cited by: 1
References: 70

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Polymer Science and PVC High voltage insulation and dielectric phenomena

Publication details

Journal / source
Polymer Degradation and Stability
Publisher
Elsevier BV
Volume
247
Pages
112005–112005
Publication date
19 February 2026
Language
EN