Molecular dynamics unveils compatibility between aromatic ester-based liquid crystalline epoxy and diamine curing agent for enhanced intrinsic thermal conductivity

Polymer 2026

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Authors: Pan Tian, W. Liu, Yisen Huang, Weiyouran Hong, Junhua Zhang
DOI: 10.1016/j.polymer.2026.129673
Cited by: 3
References: 46

Fields of Study & Subjects

Thermal properties of materials Epoxy Resin Curing Processes Polymer composites and self-healing

Publication details

Journal / source
Polymer
Publisher
Elsevier BV
Volume
346
Pages
129673–129673
Publication date
29 January 2026
Language
EN