Enabling flexible copper-clad laminates via silver-assisted patterning on sequence-defined low dielectric polyimide

Polymer 2026

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Authors: Wanying Zhang, Yongjian Zhu, Yiyong Chen, Chengbin Zou, Dou Feng, Dezhi Zhan, Hao Zhong, Jinru Li, Shilong Zhong, Rui Chen, Yanyu Gao, Cheng Wang
+1 more Xudong Chen
DOI: 10.1016/j.polymer.2026.130474
Cited by: 1
References: 41

Fields of Study & Subjects

Synthesis and properties of polymers Dielectric materials and actuators Nanomaterials and Printing Technologies

Publication details

Journal / source
Polymer
Publisher
Elsevier BV
Volume
361
Pages
130474–130474
Publication date
3 July 2026
Language
EN