Definition of a nanoindentation-based methodology to optimize process parameters of coating deposition on silicon wafer

Semiconductor industry drives energy, IT, and physics research and silicon technology is crucial in photovoltaic panels, chips, boards, e-mobility batteries, and infrared vision. Surface technologies enhance silicon functionality: coatings boost solar cell efficiency, panel passivation, and biomedical integration. Coatings like SiO2 and polycrystalline silicon bolster surface hardness for packaging and transport. Various industrially available deposition methods demand metrological control, often underexplored. This study proposes a cost-effective nanoindentation-based method to assess coating surface integrity leveraging on mechanical properties, thickness-related gradients. Results are complemented by topographical and AFM inspections. The method is applied to Chemical Vapor Deposition of SiO2/Si investigating gas-ratio effect.