Simulation and functional characterization of Cu coating on aluminum components for improvement of thermal and electrical properties

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Authors: Daniele Almonti, Gabriele Baiocco, Massimiliano Della Millia, Emanuele Mingione, Gianluca Rubino, Daniel Salvi, Nadia Ucciardello
Cited by: 0
References: 17

Abstract

The electrodeposition process holds significant industrial interest, allowing for coatings on electrically conductive materials to impart diverse properties to substrates. Primarily utilized to enhance the corrosion resistance of the base material, it is also intriguing both in industrial and academic contexts for conferring additional characteristics. This study examines the application of copper electrodeposition onto an aluminum wire to increase electrical and thermal conductivity, achieving a coating of a few microns. The varied factors include both process parameters, such as current density and electrolyte composition, and shape parameters related to the geometries of the electrode and the component to be coated.

Fields of Study & Subjects

Electrodeposition and Electroless Coatings Electronic Packaging and Soldering Technologies Surface Treatment and Coatings

Publication details

Journal / source
Procedia CIRP
Volume
138
Pages
1115–1120
Publication date
1 January 2026
Language
EN