Simulation and functional characterization of Cu coating on aluminum components for improvement of thermal and electrical properties
Abstract
The electrodeposition process holds significant industrial interest, allowing for coatings on electrically conductive materials to impart diverse properties to substrates. Primarily utilized to enhance the corrosion resistance of the base material, it is also intriguing both in industrial and academic contexts for conferring additional characteristics. This study examines the application of copper electrodeposition onto an aluminum wire to increase electrical and thermal conductivity, achieving a coating of a few microns. The varied factors include both process parameters, such as current density and electrolyte composition, and shape parameters related to the geometries of the electrode and the component to be coated.
Fields of Study & Subjects
Electrodeposition and Electroless Coatings
Electronic Packaging and Soldering Technologies
Surface Treatment and Coatings
Publication details
- Journal / source
- Procedia CIRP
- Volume
- 138
- Pages
- 1115–1120
- Publication date
- 1 January 2026
- Language
- EN