Architecting optimized thermal conduction pathways in colonnade-structured polydimethylsiloxane-based thermal interface materials by direct ink writing

中国科学通报：英文版 2026

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Authors: Kunpeng Ruan, Yuanyuan Tian, Yujia Tian, Mukun Li, Kun Zhou, Junwei Gu
DOI: 10.1016/j.scib.2026.03.011
Cited by: 23
References: 46

Fields of Study & Subjects

Thermal properties of materials Aerogels and thermal insulation Thermal Radiation and Cooling Technologies

Publication details

Journal / source
中国科学通报：英文版
Publisher
Elsevier BV
Volume
71
Issue
8
Pages
2033–2043
Publication date
4 March 2026
Language
EN