Anisotropic phase transformation of Cu6Sn5 driven by electromigration in lead-free solder joints

Scripta Materialia 2026

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Authors: C. Li, H.Z. Zhang, X.Y. Li, Zhaolong Ma, X.W. Cheng
DOI: 10.1016/j.scriptamat.2025.117154
Cited by: 1
References: 36

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Copper Interconnects and Reliability 3D IC and TSV technologies

Publication details

Journal / source
Scripta Materialia
Publisher
Elsevier BV
Volume
275
Pages
117154–117154
Publication date
8 January 2026
Language
EN