Microstructural evolution of nanotwinned copper in confined moderate-aspect-ratio through-silicon via geometries

Scripta Materialia 2026

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Authors: Yuchen Bao, Zhenliang Pan, Tiwei Wei
DOI: 10.1016/j.scriptamat.2026.117363
Cited by: 1
References: 22

Fields of Study & Subjects

Silicon and Solar Cell Technologies Microstructure and mechanical properties Thin-Film Transistor Technologies

Publication details

Journal / source
Scripta Materialia
Publisher
Elsevier BV
Volume
281
Pages
117363–117363
Publication date
23 April 2026
Language
EN