Surface adsorption and corrosion inhibition in copper CMP: A first-principles and data-driven investigation

Surfaces and Interfaces 2026

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Authors: Ramu Murali, Prabhu Kiran Vandranki, Patrick Joohyun Kim, Wei‐Tsu Tseng, Jihoon Seo
DOI: 10.1016/j.surfin.2026.108417
Cited by: 0
References: 64

Fields of Study & Subjects

Advanced Surface Polishing Techniques Copper Interconnects and Reliability Nanoporous metals and alloys

Publication details

Journal / source
Surfaces and Interfaces
Volume
81
Pages
108417–108417
Publication date
1 January 2026
Language
EN