Electroplating Cu with rich grain boundaries via gelatin addition for electrocatalytic reduction of low-concentration CO

Surfaces and Interfaces 2026

View at publisher

Authors: Yan Zhao, Xu You, Jianhua Zhang, Haoqi Fan, Haoqi Fan, Jianyu Cai, Jian Li, Xing Fan, Kailing Zhou

DOI: 10.1016/j.surfin.2026.108478

Cited by: 0

References: 28

Fields of Study & Subjects

CO2 Reduction Techniques and Catalysts Electrocatalysts for Energy Conversion Catalysts for Methane Reforming

References 28