Interfacial reactions of Sn–3.5Ag/FeCoNiMn in symmetric and asymmetric (Cu) structures: Thermal and mechanical reliability, and dual-interlayer formation validated by CALPHAD modeling

Surfaces and Interfaces 2026

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Authors: Yu-An Shen, Tzu‐Hsiang Liao, Chuan Zhang
DOI: 10.1016/j.surfin.2026.108480
Cited by: 1
References: 45

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Metallurgical and Alloy Processes Metal and Thin Film Mechanics

Publication details

Journal / source
Surfaces and Interfaces
Publisher
Elsevier BV
Volume
82
Pages
108480–108480
Publication date
13 January 2026
Language
EN