Nanoarchitectured polymeric composites with internal porous conductive network for electromagnetic interference shielding and thermal management

As modern flexible and wearable electronic devices operating on 5G platforms continue to miniaturize and advance in functionality, the demand for high-performance materials with superior electromagnetic interference (EMI) shielding efficiency and effective thermal management has significantly increased. Traditional metal-based materials, though widely used, face inherent limitations in flexibility, weight, and adaptability. In contrast, multi-scale-structured thermoplastic polyurethane (TPU) composite foams emerge as promising alternatives, offering enhanced EMI absorption, mechanical flexibility, and efficient thermal conduction. In this study, we present nanoarchitectured polymeric composites incorporating metalized hybrid foams with a dual conductive network. The design comprises interconnected microporous carbon black/TPU foams infiltrated with copper nanoparticles. These well-organized multilayer structures exhibit outstanding mechanical flexibility, enabling ultrahigh EMI shielding effectiveness (SE) exceeding 105 dB, with an absorption-to-total shielding ratio (SE A /SE T ) > 90% across a wide frequency range of 8–40 GHz. Moreover, the structure demonstrates excellent thermal management performance, attributed to the synergistic electron and phonon transport pathways of the interconnected conductive network. Additionally, multiple internal reflections and scattering within the nanoarchitectured matrix contribute to conduction and interfacial polarization losses, further enhancing EMI shielding. These nanoarchitectured composites offer a simplified yet effective strategy for managing electromagnetic wave dissipation and thermal transport in next-generation flexible electronics.