Low-temperature bonding via micro-cone array insertion with indium-mediated interfacial void elimination

Surfaces and Interfaces 2026

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Authors: Yuanxun Cui, Chongyang Li, Anmin Hu, Ming Li, Tao Hang

DOI: 10.1016/j.surfin.2026.108542

Cited by: 1

References: 41

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Copper Interconnects and Reliability

References 41