Enhanced interfacial adhesion strength and reduced warpage of copper electrodeposited epoxy composite substrates by annealing treatment

Surfaces and Interfaces 2026

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Authors: Shanjun Ding, Man Li, Mengxi Liu, Xiaomeng Wu, Chuan Chen, Qichang An, Zhidan Fang, Qidong Wang

DOI: 10.1016/j.surfin.2026.108573

Cited by: 2

References: 28

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Electrodeposition and Electroless Coatings

References 28