Surface modification of silver nanoparticles with self-assembled monolayers to mitigate electrochemical migration in fine-pitch interconnects

Surfaces and Interfaces 2026

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Authors: Chia-Hung Tsou, Wan-Hsuan Lin, Chien-Cheng Chiang, Fan-Yi Ouyang

DOI: 10.1016/j.surfin.2026.108640

Cited by: 0

References: 19

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Copper Interconnects and Reliability Nanomaterials and Printing Technologies

References 19