Effect of the etched pattern density on the thermal boundary conductance of diamond-copper composite materials

Surfaces and Interfaces 2026

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Authors: Wentao Liu, Zhiqiang Wang, Xue Li, Chao Tang, Yongwei Zhu, Jun Li
DOI: 10.1016/j.surfin.2026.108664
Cited by: 0
References: 28

Fields of Study & Subjects

Thermal properties of materials 3D IC and TSV technologies Thermal Radiation and Cooling Technologies

Publication details

Journal / source
Surfaces and Interfaces
Volume
85
Pages
108664–108664
Publication date
2 February 2026
Language
EN