Influence of molybdenum on wetting and interfacial reactivity of Ni-Mo coatings with Sn and Sn-3.5 wt. % Ag-0.5 wt. % Cu solders

Surfaces and Interfaces 2026

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Authors: Agnieszka Bigos, Marta Janusz-Skuza, Fabrizio Valenza, Sofia Gambaro, Joanna Wojewoda-Budka

DOI: 10.1016/j.surfin.2026.108749

Cited by: 0

References: 26

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Electrodeposition and Electroless Coatings Welding Techniques and Residual Stresses

References 26