Twist angle measurement of a SiC-SiC bonded wafer interface via electron diffraction

Surfaces and Interfaces 2026

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Authors: Beitian Zheng, Xu Chen, Changji Zhou, Jieqiong Zhang, Xiao Qin, Ruolan Wang, Baohua Tan, Kaixuan Li, Renhui Jiang, Jun Liu, Ke Xiao, Anli Yang
+2 more Bing Yang, Andy Shen
DOI: 10.1016/j.surfin.2026.108876
Cited by: 1
References: 21

Fields of Study & Subjects

3D IC and TSV technologies Silicon Carbide Semiconductor Technologies Advanced ceramic materials synthesis

Publication details

Journal / source
Surfaces and Interfaces
Publisher
Elsevier BV
Volume
87
Pages
108876–108876
Publication date
28 February 2026
Language
EN