Overcoming nanoscale roughness: Achieving near-bulk strength in direct diamond interface bonding

Surfaces and Interfaces 2026

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Authors: Xintian Cai, Gen Chen, Qing Peng, Rui Li, Sheng Liu
DOI: 10.1016/j.surfin.2026.109568
Cited by: 1
References: 69

Fields of Study & Subjects

3D IC and TSV technologies Advanced Surface Polishing Techniques Diamond and Carbon-based Materials Research

Publication details

Journal / source
Surfaces and Interfaces
Publisher
Elsevier BV
Volume
94
Pages
109568–109568
Publication date
14 May 2026
Language
EN