Construction rivet structure on build-up film with low surface roughness and high adhesion strength for IC packaging substrates

Surfaces and Interfaces 2026

View at publisher

Authors: Junyi Yu, Yiquan Yang, Yuchen Liu, Wen-di Li, Pengpeng Xu, Yu Wang, Shuhui Yu, Suibin Luo

DOI: 10.1016/j.surfin.2026.109671

Cited by: 1

References: 22

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Adhesion Friction and Surface Interactions

References 22