Conductivity mechanisms of the nanocomposite SiOx(Si)&CuyO(Cu) films
Fields of Study & Subjects
Copper Interconnects and Reliability
Copper-based nanomaterials and applications
Dielectric properties of ceramics
Publication details
- Journal / source
- Thin Solid Films
- Publisher
- Elsevier BV
- Volume
- 836
- Pages
- 140874–140874
- Publication date
- 24 January 2026
- Language
- EN