Structurally ordered glucose-derived carbon coatings enabling enhanced Cu–C interfacial thermal transport in 3D copper foams
Fields of Study & Subjects
Thermal properties of materials
Heat Transfer and Boiling Studies
3D IC and TSV technologies
Publication details
- Journal / source
- Vacuum
- Volume
- 248
- Pages
- 115170–115170
- Publication date
- 10 February 2026
- Language
- EN