Microstructure, sputtering performance, and film properties of Ag-1wt.%Cu alloy targets: A comparative study with pure Ag

Vacuum 2026

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Authors: Xin Li, Menghang Sun, Z.Y. Li, Linchi Chen, Jinghong Chen, Yunxiu Chao, Guohua Liu, Ming Wen, Xizhang Chen, Chengfa Mu

DOI: 10.1016/j.vacuum.2026.115216

Cited by: 1

References: 42

Fields of Study & Subjects

Copper Interconnects and Reliability Microstructure and mechanical properties Copper-based nanomaterials and applications

References 42