Pressure-driven gas phase transport and wafer rotation effects in LPCVD TEOS-SiO2 trench filling for CMOS STI applications

Vacuum 2026

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Authors: Fatma Betül Akgül Taner

DOI: 10.1016/j.vacuum.2026.115322

Cited by: 1

References: 19

Fields of Study & Subjects

Copper Interconnects and Reliability Semiconductor materials and devices Silicon and Solar Cell Technologies

References 19