Enhancing the microstructure and mechanical properties of NiV/Cu diffusion-bonded joints via a magnetron-sputtered Ni interlayer

Vacuum 2026

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Authors: Jingyu Li, Jinghong Chen, Ming Wen, Yunxiu Chao, Chenqi Shi, yiqing Wang, Yiqing Wang, Sixie Li, Chuanjun Wang

DOI: 10.1016/j.vacuum.2026.115346

Cited by: 1

References: 32

Fields of Study & Subjects

Microstructure and mechanical properties Electronic Packaging and Soldering Technologies Metal and Thin Film Mechanics

References 32