Effect of cold rolling deformation on microstructure and properties of Cu-Ni-Si alloy during secondary aging
Fields of Study & Subjects
Microstructure and mechanical properties
Electrodeposition and Electroless Coatings
Copper Interconnects and Reliability
Publication details
- Journal / source
- Vacuum
- Publisher
- Elsevier BV
- Volume
- 252
- Pages
- 115410–115410
- Publication date
- 28 April 2026
- Language
- EN