The electrical performance analysis of multilayer graphene nanoribbon based through silicon via in three-dimensional integrated circuits

Integration 2026

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Authors: Zongjie Zeng, Fan Yu, Qiang Liao, Huan Huang, Fa Zou, Peng Fei Xu

DOI: 10.1016/j.vlsi.2026.102675

Cited by: 0

References: 51

Fields of Study & Subjects

3D IC and TSV technologies Copper Interconnects and Reliability VLSI and Analog Circuit Testing

References 51