Influence of grinding damage on the minimum chip thickness and subsurface damage in scratching of YAG wafer

Wear 2026

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Authors: Jinxing Huang, ZhiGang DONG, Renke Kang, Shang Gao

DOI: 10.1016/j.wear.2026.206577

Cited by: 2

References: 35

Fields of Study & Subjects

Advanced Surface Polishing Techniques Advanced machining processes and optimization Laser Material Processing Techniques

References 35