Thermal process monitoring for layer adhesion by tracking nozzle position in material extrusion
Abstract
ABSTRACT: We present a thermal process-monitoring system for MEX tracking layer temperature as a proxy for interlayer adhesion. Python-based hottest-point tracking by infrared thermography is implemented on a chamber-heated desktop printer to track nozzle movements and measure the temperature field millimeters ahead of deposition logging the results on a CSV file. We quantify accuracy versus camera distance (Δd=73mm) and probe radius (R2-R5). Where R3-R4 provided just a ΔRMSE of 1.52°C suggesting R3 as the optimal distance. The results can inform mechanical properties in load-bearing AM applications.
Fields of Study & Subjects
Additive Manufacturing Materials and Processes
Additive Manufacturing and 3D Printing Technologies
Thermography and Photoacoustic Techniques
Publication details
- Journal / source
- Proceedings of the Design Society
- Publisher
- Cambridge University Press (CUP)
- Volume
- 6
- Pages
- 1881–1890
- Publication date
- 2 July 2026
- Language
- EN