A Structurally Decoupled Single-Layer Soft Electronic Skin for Fast, Reliable, and Simultaneous Temperature–Pressure Sensing

Multimodal electronic skin capable of fast, reliable, and simultaneous sensing of two stimuli, temperature and pressure, remains challenging. Here, we present a single-layer temperature-pressure multisensing soft electronic skin with simple structural decoupling strategy based on a ridge-valley shaped elastic structure (RVES) using a resistive sensing mechanism. The sensor employs magnetically aligned filamentous Ni-PDMS conduction pathways, exhibiting stable temperature sensing from 0 to 75 °C and linear pressure sensing up to 155 kPa, with an ultrafast response time of 92 ms (temperature) and 48 ms (pressure). The sensor further demonstrates excellent reliability, maintaining consistent performance over 200 thermal cycles (25-55 °C) and 1000 pressure cycles at 94 kPa. By integration of the RVES into a soft sensor array, temperature-only and pressure-sensitive pixels are spatially separated within a single layer, allowing independent extraction and spatial mapping of temperature and pressure distributions. These capabilities are demonstrated in an 11 × 11 soft sensor array under simultaneous multimodal stimuli, highlighting the simplicity, reliability, and scalability of the proposed electronic skin.