Strategies for the Integration of Multifunctional Thermal Management Materials: A Review

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Authors: Jianan Song, Guangxing Huang, Feng Wei, Lingxiao Sun, Chao Hu, Beibei Chen, Kan Zhang
Cited by: 1
References: 214

Abstract

The rapid development of high-power electronics, flexible devices, and advanced energy systems has created a growing demand for thermal management materials that combine heat dissipation with additional functions such as electrical insulation, electromagnetic interference shielding, flame retardancy, mechanical compliance, and environmental stability or other application-specific functions. The central challenge in multifunctional thermal management materials (MTMMs) lies not simply in improving thermal conductivity but in integrating thermal management with other required functions within the same material system. From the perspective of functional integration, this review classifies MTMMs as passive or stimuli-responsive. Passive MTMMs rely on material composition, filler design, and structural construction to form heat-conduction pathways while supporting other functions. Stimuli-responsive MTMMs regulate heat transport and associated functional performance through reversible changes induced by electric or magnetic fields, light, or humidity. This classification clarifies the design logic, relationships among integrated functions, and applicability of different MTMM systems. Representative applications, including wearable electronics and battery thermal management, are also discussed to connect material design to practical requirements. Future research directions include recyclable MTMMs, long-term thermomechanical stability, and AI-assisted analysis of structure-function relationships. This review provides a systematic perspective for the development of next-generation thermal management materials.

Fields of Study & Subjects

Thermal properties of materials Thermal Expansion and Ionic Conductivity Thermal Radiation and Cooling Technologies

Publication details

Journal / source
ACS Applied Materials & Interfaces
Publisher
American Chemical Society (ACS)
Volume
18
Issue
33
Pages
44821–44849
Publication date
14 August 2026
Language
EN