High-Performance Poly(aryl ether ketone) Foams with Low Dielectric Constant and Dielectric Loss

The advancement of high-frequency communication technologies has necessitated the development of materials exhibiting low dielectric constants and minimal dielectric loss. Among various approaches, the most effective strategy for fabricating low-dielectric materials involves the incorporation of air into a polymer matrix. In this investigation, poly(aryl ether ketone) containing fluorenyl groups (PEK-F) was synthesized to produce high-performance foams characterized by inherent flame retardancy (OI ≥ 33.7%), high temperature resistance, an exceptionally low dielectric loss ( D f = 0.0003), and a dielectric constant (ε) of 1.07 at high frequency. The enhanced properties of the PEK-F foams are attributed to the rigid molecular chains of the PEK-F resin, which confer notable mechanical strength even at elevated temperatures of up to 180 °C. This thermal stability is critical for electronic components used in high-frequency communication systems that undergo high-temperature processing. Additionally, the PEK-F foams demonstrate excellent processability, as evidenced by their ability to be fabricated into flexible and transparent slices, a feature enabled by their uniform microcellular structure. These characteristics underscore the potential applicability of PEK-F foams in precision electronic components.