Autonomous In Situ Biointerfacing Platform for Real-Time Electrophysiological Monitoring and Advanced Wound Management

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Authors: Wenting Yu, Sanwei Hao, Guohao Zhang, Zhouyang Hu, Ruidong Jin, Xianying Xu, Jing Cai, Jun Yang, Changyou Shao, Ning Zhang, Y H Bai
Cited by: 3
References: 51

Abstract

High Resolution Image Download MS PowerPoint Slide Flexible bioelectronic interfaces hold great promise for advancing modern healthcare and human–machine interactions. However, current bioelectronic interface technologies remain constrained by the intricate surface conditions of injured tissues. Even with intimate tissue-electrode adhesion, achieving simultaneous sensing and therapeutic intervention poses a formidable challenge. Here, we employed the principle of liquid-to-solid conversion to develop a seamless in situ forming biointerface platform, TLMG hydrogel, with robust and stable adhesion to irregular skin wounds, enhanced mechanical properties, real-time high-fidelity signal monitoring, and on-demand therapeutic effect for wound healing. By incorporating tea polyphenols/lignin microspheres, the TLMG hydrogel effectively achieved the integration of bioelectronic and bioactive interfaces. The multiple features of this in situ biointerface encompassed robust in situ adhesion (200 kPa), high ionic conductivity (0.27 mS cm –1 ), and exceptional mechanical stability. Furthermore, the findings from several complex animal models and human tests proved the intelligent wound management, real-time dynamic signal monitoring, and wound healing boosting via immunomodulatory mechanisms. These results convincingly indicate that the TLMG biointerfacing platform provides a promising solution for integrated bioelectronic medicine for wearable healthcare systems.

Fields of Study & Subjects

Wound Healing and Treatments Advanced Sensor and Energy Harvesting Materials Planarian Biology and Electrostimulation

Publication details

Journal / source
ACS Nano
Publisher
American Chemical Society (ACS)
Volume
20
Issue
7
Pages
5764–5780
Publication date
12 February 2026
Language
EN