Side-Chain Free Semiconducting Polymer for High-Performance n-Type Organic Electrochemical Transistors

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Authors: Yuyun Yao, Mustafeez Bashir Shah, Wanpeng Lu, Xian’e Li, Rushil Vasant, Zeinab Hamid, Keren Ai, Junfu Tian, Maryam Alsufyani, Jonathan Rawle, Malina Gaşpar, Qingpei Wan
+7 more Rachael Found, Wesley Chen, Tomaž Kotnik, Thuc-Quyen Nguyen, Achilleas Savva, James R. Durrant, Iain McCulloch
Cited by: 5
References: 56

Abstract

High Resolution Image Download MS PowerPoint Slide The development of organic electrochemical transistors (OECTs) critically depends on the design and characterization of mixed-conducting, high-performance conjugated polymers (CPs) as channel materials, particularly for n-type OECTs. In this study, we present a novel strategy to enhance the OECT performance of a semiconducting polymer film via a postdeposition ester pyrolysis of thermally cleavable side chains, thus facilitating ion incorporation and transport within the bulk. Our approach relies on the synthesis of a high glass-transition, rigid-rod polymer, able to withstand the pyrolysis temperature without deformation and maintain the voids formed from the pyrolysis reaction which removes the thermally cleavable ester side chains. After side-chain cleavage, the resulting film exhibits increased porosity, hydrophilicity, and crystallinity. By creating bulk porosity in thin films via this approach, ion diffusion is enhanced, resulting in a superior μ C* figure of merit up to 158.85 F cm –1 V –1 s –1, and a corresponding increase in normalized transconductance (31.67 S cm –1 ). In addition, the device switching speed and long-term stability are also observed to increase, further demonstrating the benefit of nanoscale porosity for mixed conductivity semiconductors.

Fields of Study & Subjects

Conducting polymers and applications Organic Electronics and Photovoltaics Supercapacitor Materials and Fabrication

Publication details

Journal / source
Journal of the American Chemical Society
Publisher
American Chemical Society (ACS)
Volume
148
Issue
9
Pages
9494–9503
Publication date
26 February 2026
Language
EN