Advances in waveguide to waveguide couplers for 3D integrated photonic packaging
Abstract
In this paper, we provide an overview and comparison of devices used for optical waveguide-to-waveguide coupling including inter-chip edge couplers, grating couplers, free form couplers, evanescent couplers, cantilever couplers, and optical wirebonds. In addition, technology for efficient transmission of light through chips is discussed including guided mode and free form photonic vias for substrates including silicon, glass, and organics. The results are discussed in the context of potential applications including co-packaged optics switch packages, replaceable biochemical sensors, optically connected memory, optical computing, integrated quantum photonics, and integrated LiDAR systems to show possible improvements in energy efficiency, performance, and cost.
Fields of Study & Subjects
Photonic and Optical Devices
Semiconductor Lasers and Optical Devices
3D IC and TSV technologies
Publication details
- Journal / source
- Light Science & Applications
- Publisher
- Springer Science and Business Media LLC
- Volume
- 15
- Issue
- 1
- Pages
- 17–17
- Publication date
- 1 January 2026
- Language
- EN