Machine learning based real-time assessment of fabrication deviation induced mechanical performance variations in stretchable silicon arrays

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Authors: Bo Wen, Han Xu, Yikang Ding, Qi Wang, Pan Zhang, Chi Zhang, Wei Wang
Cited by: 0
References: 37

Abstract

Microelectromechanical system fabrication represents a promising approach for silicon-based flexible electronics, leveraging its scalability and miniaturization merits. However, fabrication-induced geometric deviations stretchable microstructures can result in significant variations in mechanical performances. Current assessment methods lack sufficient accuracy for these precision-sensitive manufacturing processes. This work proposes a machine-learning (ML)-based assessment methodology for accurately and rapidly predicting the mechanical performances, including equivalent Young's modulus and the maximum elastic stretchability, of Parylene three-dimensional micro-Kirigami stretchable structures in a stretchable silicon array affected by the fabrication-induced geometric deviations. By applying the dimensionality reduction technique specifically designed for few-shot ML modeling, the framework achieves prediction accuracies exceeding 95% on the test set. SHapley Additive exPlanations (SHAP) analysis is further utilized to quantify the impact of various geometric features on mechanical performances. This ML-based assessment methodology successfully facilitates real-time feedback from process-induced geometric deviations to the qualification probability of mechanical performances. This proposed approach supports design-for-manufacturability (DFM) of silicon-based stretchable arrayed devices manufacturing and lays the foundation for high-consistency wafer-scale manufacturing of high-performance stretchable silicon electronics.

Fields of Study & Subjects

Advanced MEMS and NEMS Technologies Machine Learning in Materials Science Advanced Sensor and Energy Harvesting Materials

Publication details

Journal / source
Microsystems & Nanoengineering
Volume
12
Issue
1
Pages
55–55
Publication date
10 February 2026
Language
EN