Strain-invariant omnidirectional stretchable MXetronics

Titanium carbide MXene flakes hold great promise for system-level MXene-based electronics (MXetronics) due to their outstanding electrical conductivity and diverse functional properties. However, the weak MXene interlayer bonding often causes film fracturing under mechanical strain, ultimately leading to device failure, manifested as unstable operation, inaccurate data transmission, and potential electrical disconnection. Here, we present strain-invariant, omnidirectionally stretchable MXetronics (sos-MXetronics) through hierarchical stiffness microgrid engineering. This strategy synergistically integrates patterned elastiff regions and modulus-buffered interconnects, effectively preventing performance shifts in sos-MXetronics. This circular sos-MXetronics with a radius of 3.3 cm integrates a near-field communication (NFC) antenna, eight micro-supercapacitors (MSCs), three resistive sensors, and interconnected conductive networks, demonstrating exceptional strain invariance with 95-98% performance retention even under 40% strain. With the capability to minimize motion-induced artifacts, the system ensures accurate blood pressure (BP) monitoring without electrical disconnection, even during wrist deformations. This breakthrough not only marks a significant step toward the practical application of MXene in omnidirectional stretchable MXetronics, but also paves the way for reliable, high-performance electronics based on two-dimensional materials for next-generation healthcare monitoring systems that seamlessly integrate with the human body under real-world conditions.